The Mini Copper CPU Glue Remove Station is a precision-engineered tool designed to safely and efficiently remove thermal adhesive, epoxy, and soldering residue from CPU and GPU chips. Perfect for rework technicians, repair professionals, and DIY enthusiasts, this compact station utilizes high-conductivity copper to deliver consistent heat, allowing for easy softening and removal of stubborn glue and underfill without damaging the chip or PCB. Key Features: # High Thermal Conductivity Copper Plate Ensures rapid and even heat distribution for safe glue removal. # Temperature Control System Adjustable heat settings (typically 100°C–300°C) to suit various adhesive types and chip materials. # Compact & Portable Design Mini form factor makes it ideal for desktop use in repair labs or mobile service setups. # ESD-Safe Construction Protects sensitive components from static damage during operation. # Wide Compatibility Suitable for Intel, AMD, NVIDIA CPUs/GPUs and other IC chips used in laptops, desktops, and gaming consoles. Applications: <Removing black glue (underfill) from mobile phone CPU/IC chips <Preparing CPUs for delidding and repasting <Reballing or reworking BGA chips <Cleaning thermal adhesive residue from chip surfaces