Lanrui Second Generation CPU Glue Removal
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Rs. 550
Descriptions
The Lanrui CPU Glue Remover Liquid (250 mL) is a specialized adhesive dissolving solution designed for safely removing hardened bonding glues—such as epoxy, phenolic resins, or sealing adhesives—from mobile device chips and motherboard surfaces. It enables clean CPU or IC chip removal without requiring heat, making it suitable for delicate electronic components.
✅ Key Features & Working Nature
# Adhesive Softening Formula
Softens strong adhesives used under BGA chips, CPUs, or NAND ICs—allowing technicians to gently remove glued components without using heat.
# Safe for Electronics
Specifically formulated to avoid damaging PCB traces or electronic components when used properly.
# Non-Heated Application
Requires no thermal application—just soak or apply the liquid and wait for 15–30 minutes before mechanical removal.
# Eco-Friendly and Technician-Safe
Less harmful than harsh solvent alternatives; designed with safety and minimal residue in mind.
# Convenient Volume
Typically supplied in a 250 mL bottle, enough to support multiple glue removal operations.
🛠️ Typical Applications
*Removing hardened CPU, BGA, NAND, or IC glue in mobile phones and tablets
*Safe motherboard cleaning before chip replacement or reballing
*IC adhesive softening during mobile repair micro-soldering tasks
