Lanrui Fill Active Beads
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Rs. 560
Descriptions
Lanrui CT60 CT80 Fill Active Beads Solder Balls Soldering Wire Without Flying Wire for IPhone Android Motherboard Repair Tool
Lanrui Fill Active Beads (CT60 / CT80) are pre-fluxed micro solder balls designed for precision soldering and pad repair in electronic devices like smartphones, tablets, and PCBs. These beads are ideal for filling broken jumper points, reballing chips, and restoring damaged solder pads during motherboard or chip-level repairs.
🛠️ Key Features:
✅ Pre-fluxed surface – no need for extra solder paste or flux
✅ High-precision application – excellent for micro jumpers, BGA pads, or missing pad recovery
✅ Anti-splash, anti-static design – clean, safe, and efficient
✅ Fast bonding with heat – just place the bead and apply heat to complete the connection
✅ Ideal for smartphone and logic board repair
📦 Package includes: ~25,000 beads per bottle
🔧 Common Applications:
Reballing iPhone/Android CPU or NAND chips
Filling jumper pads and broken circuit lines
Motherboard trace repair
Precision micro-soldering tasks
